Previous Research

My research title is LED engine module. Most LED has difficulties to resolve poor performance of heat transfer, especially in high-power LED, which is the main reason to cause heats failure. The goal of my research is to raise efficiency of heat conductivity, reduce thermal expansion and enhance luminous efficiency to make LED more stable.

Firstly, MMC can replace conventional printed circuit board, and improve thermal conductivity by using higher thermal conductivity paste. It has a significant advantage to enhance the thermal conductivity and reduce the instability caused by expansion. Secondly, expanding the thermal channel between light-emitting chip and MMC, then welding Stannum as the thermal channel, so that heat can be transfer directly from light-emitting chip to MMC and then to radiator. Next, I change the design of chip arrangement, from the conventional side-by-side to the present centralized. It can greatly improve its effective lighting area and luminous intensity, and reduce its size, which has enormous helps to increase the diversity of applications.

This research has gained patent in Taiwan, China and Germany. The product has already applied in wide range of industries, including automobile, factory, fishery and forth on.